this post was submitted on 03 Sep 2024
129 points (96.4% liked)

Technology

59174 readers
4341 users here now

This is a most excellent place for technology news and articles.


Our Rules


  1. Follow the lemmy.world rules.
  2. Only tech related content.
  3. Be excellent to each another!
  4. Mod approved content bots can post up to 10 articles per day.
  5. Threads asking for personal tech support may be deleted.
  6. Politics threads may be removed.
  7. No memes allowed as posts, OK to post as comments.
  8. Only approved bots from the list below, to ask if your bot can be added please contact us.
  9. Check for duplicates before posting, duplicates may be removed

Approved Bots


founded 1 year ago
MODERATORS
you are viewing a single comment's thread
view the rest of the comments
[–] [email protected] 1 points 2 months ago (1 children)

800 is reticle, they're not past that, it doesn't make sense.

They chiplet past 500, the economics break down otherwise.

[–] [email protected] 1 points 2 months ago (1 children)

They chiplet past 500

I don't know if I'm using the right vocabulary, maybe "die size" is the wrong way to describe it. But the Ultra line packages two Max SoCs with a high performance interconnect, so that the whole package does use about 1000 mm^2 of silicon.

My broader point is that much of Apple's performance comes from their willingness to actually use a lot of silicon area to achieve that performance, and it's very expensive to do so.

[–] [email protected] 2 points 2 months ago

You could say total die size, but you wouldn't say die, that implies a single cut exposure of silicon.

But agreed, Apple just took all the tricks Intel dabbled with and turned them to 11, Intel was always too cheap because they had crazy volumes (and once upon a time had a good process) and there was no point.